产品分类结果页

低功耗嵌入式工控机-EPC-1101

★Intel® Processor Industrial RE Series
★On Board OOB built-in
★Slim and fanless design for limited-space condition
★Intel TCC within the system
★On Board DDR5 & eMMC Support
★Up to Quad Display Support via HDMI/USB-C/VGA, Quad display support by Dev

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低功耗嵌入式工控机-EPC-1102

★Qualcomm QCS6490 high-level platform- 8 cores, up to 2.7 GHz, 12 TOPS
★High-speed LPDDR5x memory with up to 8 GB on board
★Multiple Expansions: 1 M.2 E key 2230, 1 M.2 B key 3052 for Wi-Fi/BT, LTE application
★Rich I/O: 2 USB 3.1,1 GbE LAN, 1 HDMI,1 Audio Jack, 1 COM, 8 bit DIO/1 CAN FD
★Autonomous Mobile Robot and box PC applications support

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低功耗嵌入式工控机-EPC-1103

★14th Generation Intel® Ultra 5/ Ultra 7 CPU (12W)
★Industrial NUC compact system
★Two DDR5 SODIMM, up to 64GB
★Up to -20°C~50°C operation with passive cooling, optional fan cooling 12VDC power in
★Ultra compact size (W x H x D): 111 x 51.1 x 106 mm
★Supports M.2 2230 E-Key/M.2 2280 M-Key, Storage: M.2 2280 M-key (NVME)
★I/O: 2 2.5GbE (TSN/TCC), 2 USB 3.2, 2 Type-C, 2 HDMI, 1 DB9 (RS232/422/485), 1 DB9 (RS232/DIO)
★Supports M.2 Hailo AI accelerator card(M.2 E key, optional)

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低功耗嵌入式工控机-EPC-1104

★Intel® Atom® Alder Lake-N Processors
★1 DDR5 4800 MT SO-DIMM up to 32GB
★Dual Displays: 1 HDMI, 1 Type-C DP
★Multiple Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
★Rich I/O: 3 2.5GbE LAN, 4 USB 3.2, 2 USB 2.0, 1 COM, 1 Line-out, 1 Mic-in

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低功耗嵌入式工控机-EPC-1105

★Intel® Processor N-series/Atom® Processor X Series
★On Board OOB built-in
★Slim and fanless design for limited-space condition
★Intel TCC within the system
★On Board DDR5 & eMMC Support
★Up to Quad Display Support via VGA/HDMI/USB-C

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低功耗嵌入式工控机-EPC-1106

★12th Gen Intel® Core™ Alder Lake-P Processor
★On board memory 8GB and 1 SO-DIMM DDR4
★Dual Displays: HDMI (4K@30Hz) + DP (4K@60Hz)
★Support M.2 B key 3042/3052 5G-NR module
★Rich I/O: up to 3 LAN & 4 USB3.2 (or 2 USB3.2 + 2 USB type-C)

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低功耗嵌入式工控机-EPC-1107

★Intel Atom® x5-E3940 Processor
★Sleek and stylish mini computer
★Support up to 4K digital content by 2 displays
★Support PoE PD 802.3af 12.95W
★Diverse I/O: 1 USB 3.1 Type C, 1 USB 3.1 Type A, 2 USB 2.0 Type A, 1 LAN, 1 3.5mm Audio Jack
★15-Year CPU Life Cycle Support Until Q4' 31 (Based on Intel IOTG Roadmap)

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低功耗嵌入式工控机-EPC-1108

★Qualcomm® Robotics RB5 Platform: QRB5165
★On Board Memory: LPDDR5
★Dual Display: Main HDMI + Second USB Type-C DP
★Rich I/O Expansion: 1 LAN, 4 USB, 1 COM, 1 DIO, 1 CAN
★5G Support: Support M.2 B key 3052 bounding with RM502G (Quectel)

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低功耗嵌入式工控机-EPC-1109

★NXP i.MX8M Mini Platform: Quad Core Max.1.8GHz
★High Speed Memory Down: LPDDR4 3200MHz
★Multiple Expansions: M.2 support, WiFi/BT, LTE
★Rich I/O: 2 GbE LAN, 2 USB, 4bit DIO, RS422, RS485
★Wide Voltage: Support 9~36VDC

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低功耗嵌入式工控机-EPC-1110

★Intel® Atom® Processors X Series Fanless Embedded System
★Support 5G Sub-6 module
★Support WiFi 6 module
★4 LAN: Support 1 x 2.5GbE TSN , 3 x GbE LAN
★Wide Operating Temperature: Support up to -40 ~ 60°C (Intel® Embedded Series)
★Support Isolated COM & DIO
★15-Year CPU Life Cycle Support Until Q1' 36 (Based on Intel IOTG Roadmap)

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低功耗嵌入式工控机-EPC-1111

★11th Gen Intel® Core™ i7/i5/i3 Processors
★On board memory 8GB and 1 SO-DIMM DDR4
★Triple Displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz)
★Support M.2 B key 3042/3052 5G-NR module
★Up to 4 LAN or 6 USB
★15-Year CPU Life Cycle Support Until Q3' 35 (Based on Intel IOTG Roadmap)

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低功耗嵌入式工控机-EPC-1112

★8th/9th Gen Intel® Core™ Processors with Intel® C246/Q370/H310 Chipset
★Two DDR4 SODIMM up to 64GB
★Single/Triple storage: 1 x M.2 SSD + 2 x 2.5" SSD (configured option) (with RAID supported)
★Rich I/O connectivity: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0, 2 COM
★2 HDMI 2.0 Support resolution 4K@60Hz
★15-Year CPU Life Cycle Support Until Q2' 34 (Based on Intel IOTG Roadmap)

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低功耗嵌入式工控机-EPC-1113

★AMD Ryzen™ Embedded R1000 Series
★Ultra Small Size: 112.29 x 80 x 56.20mm (W x H x D)
★Opt. Mini-PCIE module with RS232/LTE/WIFI function
★User friendly design for SIM card installation
★I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI
★10-Year CPU Life Cycle Support Until Q1' 30 (Based on AMD Roadmap)

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低功耗嵌入式工控机-EPC-1114

★Intel Atom® x5-E3940 Processor, Quad Core, 2M Cache, 1.6GHz (1.8GHz), 9.5W
★Intel® Celeron® Processor N3350, Dual Core, 2M Cache, 1.1GHz (2.4GHz), 6W
★Support Adaptive Display Platform
★Supports 24V / 9~48V Power Board Module
★Accessible 2.5" SATA Drive Bay
★12V/24V/48V Ignition Power Control
★Wide Operating Temperature: -40 to 70°C

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低功耗嵌入式工控机-EPC-1115

★Intel Atom® E3845, Quad Core, 2M Cache, 1.91GHz, 10W
★Intel® Celeron® J1900, Quad Core, 2M Cache, 2GHz (2.41GHz), 10W 22nm Process Technology
★4GB DDR3L onboard
★mSATA, eMMC (optional)
★1x 2.5" SATA drive bay
★6 COM, 5/6 USB, 2 LAN
★Supports 3G/4G and GPRS application
★15-Year CPU Life Cycle Support Until Q4' 28 (Based on Intel IOTG Roadmap)

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低功耗嵌入式工控机-EPC-1116

★Intel Atom® Processor E3900 Series
★DDR3L-1866 memory onboard + 1 SODIMM up to 8GB
★Displays: 1 DP/HDMI combo + 1 DP/VGA
★Supports 2 Mini PCIe and 1 M.2 E-Key
★Rich I/O ports: up to 4 COM and 4 Intel GbE+2 USB or 2 Intel GbE+4 USB
★Extended operating temperature: -40 to 70°C (x7-E3950/ x5-E3940/ x5-E3930)
★15-Year CPU Life Cycle Support Until Q4' 31 (Based on Intel IOTG Roadmap)

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低功耗嵌入式工控机-EPC-1117

★7th Generation Intel® Core™ Processors, BGA 1356
★Compact and Fanless Embedded System
★4GB/8GB DDR4 memory onboard
★1 x 2.5" SATA 3.0 drive bay (for thickness 7mm only)
★Supports 2 Mini PCIe for mSATA & wireless application
★Rich I/O ports: 2 Intel GbE, 6 COM, 4 USB 3.0, 4 USB 2.0
★15-Year CPU Life Cycle Support Until Q1' 32 (Based on Intel IOTG Roadmap)

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低功耗嵌入式工控机-EPC-1118

★6th/7th Generation Intel® Core™ Processors, BGA 1356
★Supports 1 Mini PCIe and 1 M.2 slots
★Rich I/O connectivity: 2 GbE, 4 USB 3.0, 2 USB 2.0
★1x 2.5" SATA 3.0 drive bay
★HDMI resolution supports up to 4096x2304 @ 24Hz
★Supports DDR4 SODIMM up to 32GB
★15-Year CPU Life Cycle Support Until Q3' 30 (Based on Intel IOTG Roadmap)

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低功耗嵌入式工控机-EPC-1119

★Intel Atom® Processor E3900 Series, BGA 1296
★Extended operating temperature: -20 to 60°C
★Rich I/O ports: 2 Intel GbE, 1 COM, 3 USB
★Supports 1 Mini PCIe
★Mini-DP++ resolution supports up to 4096x2160 @ 60Hz
★2GB/4GB LPDDR4-2400 memory onboard
★Palm-sized and Fanless Embedded System
★15-Year CPU Life Cycle Support Until Q4' 31 (Based on Intel IOTG Roadmap)

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低功耗嵌入式工控机-EPC-1120

★NXP i.MX6 Series Processor
★ARM架构无风扇嵌入式系统
★1GB/2GB DDR3L 板贴內存
★8GB/16GB eMMC储存
★DIN Rail Mount
★丰富I/O接口: 2 GbE, 2 COM, 2 USB 2.0, 1 USB OTG
★15年CPU长期支持至Q1' 27 (Based on NXP Roadmap)

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低功耗嵌入式工控机-EPC-1121

★Intel Atom® 处理器 E3900
★2GB/4GB/8GB LPDDR4-2400 板载内存
★三个独立显示: 1 VGA/DVI-D + 2 Mini-DP/Micro-HDMI
★支援 1 Mini PCIe 及 2 M.2
★丰富I/O接口: 2 Intel 网口, 2 串口, 4 USB
★15年CPU长期支持至Q4' 31 (Based on Intel IOTG Roadmap)

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低功耗嵌入式工控机-EPC-1122

★第六代Intel® Core™ 无风扇嵌入式系统
★4GB/8GB DDR4 板载内存
★1x mSATA-mini 及 1x M.2 / CFast 储存
★支持 2 Mini PCIe 可用于无线通信应用
★丰富I/O接口: 2 PoE, 2 Intel 网口, 6 串口, 6 USB 3.0
★15年CPU长期支持至Q3' 30 (Based on Intel IOTG Roadmap)

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低功耗嵌入式工控机-EPC-1123

★第六代/第七代Intel® Core™ 无风扇嵌入式系统
★4GB/8GB DDR4 板载内存
★1x 2.5" SATA 3.0 磁盘架
★支持 2 Mini PCIe 可用于 mSATA 和无线通信应用
★丰富I/O接口: 2 Intel 网口, 4 串口, 4 USB 3.0
★15年CPU长期支持至Q3' 30 (Based on Intel IOTG Roadmap)

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低功耗嵌入式工控机-EPC-1124

★Intel Atom® 处理器 E3800
★4GB/2GB DDR3L ECC 板载内存
★1x 2.5" SATA 磁盘架
★支持 Wi-Fi、3G/4G及GPRS应用
★纠错码（ECC）提供数据完整性、可靠性和系统正常运行时间
★15年CPU长期支持至Q1' 28 (Based on Intel IOTG Roadmap)

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低功耗嵌入式工控机-EPC-1125

★Intel Atom® 处理器 E3800
★4GB/2GB DDR3L 板载内存
★1x 2.5" SATA 磁盘架
★4x Gigabit 网口 ports
★支持 Wi-Fi、3G/4G及GPRS应用
★15年CPU长期支持至Q4' 28 (Based on Intel IOTG Roadmap)

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高性能嵌入式计算机-EPC-1201

★14th/13th/12th Generation Intel® Core™ with Intel® H610E/R680E
★Supports DDR5 SODIMM up to 64GB
★Rich I/O connectivity: 2 2.5GbE, 4 GbE(or 2 GbE, 2 PoE), 10 COM, 5 USB 3.2(Gen2x1), 1 USB Type-C
★Multiple Expansion: 5 M.2 slots
★Support 5G Communication
★Operating Temperature: -20 to 70°C
★15-Year CPU Life Cycle Support Until Q4' 36 (Based on Intel IOTG Roadmap)

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高性能嵌入式计算机-EPC-1202

★12th Generation Intel® Core™ with Intel® Q670E
★Supports DDR4 SODIMM up to 64GB
★Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
★Support 4 PoE (EC543-ADS62GA6E-Q)
★Multiple Expansion: 3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
★Support 5G communication
★Operating Temperature: -20 to 60°C

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高性能嵌入式计算机-EPC-1203

★12th Generation Intel® Core™ with Intel® Q670E
★Supports DDR4 SODIMM up to 64GB
★Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
★Support up to 4 PoE (EC51x-ADS62GA6E-Q)
★Support 5G communication
★Multiple Expansion: 3 M.2 and 1 PCIe or 1 PCI
★Operating Temperature: -20 to 60°C

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高性能嵌入式计算机-EPC-1204

★8th/9th Generation Intel® Core™ Processors
★Multiple displays: 4 DP (from MXM), 1 DP/HDMI
★AI Accelerated: Up to 60W GPU MXM module supported
★Scalability: 3 M.2 expansion slots
★Support M.2 B key 3052 5G cellular module
★Rich I/O connectivity: 4 LAN, 4 USB 3.1, 2 COM

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高性能嵌入式计算机-EPC-1205

★12th Generation Intel® Core™ with Intel® H610E/Q670E/R680E
★Supports DDR4 SODIMM up to 64GB
★Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
★Rich I/O connectivity: 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0
★Multiple Expansion: 3 M.2 slots
★Support 5G Communication
★Operating Temperature: -20 to 70°C
★15-Year CPU Life Cycle Support Until Q4' 36 (Based on Intel IOTG Roadmap)

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高性能嵌入式计算机-EPC-1206

★8th/9th Generation Intel® Core™ with Intel® Q370
★Supports DDR4 SODIMM up to 64GB
★Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
★Support 4 PoE (EC543-CS6G86E-Q)
★3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
★Support 5G Communication
★Operating Temperature: -20 to 60°C
★15-Year CPU Life Cycle Support Until Q2' 34 (Based on Intel IOTG Roadmap)

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高性能嵌入式计算机-EPC-1207

★8th/9th Generation Intel® Core™ with Intel® Q370/H310
★Supports DDR4 SODIMM up to 64GB
★Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
★Support 4 PoE (EC51x-CS6G86E-Q)
★1 PCIe and 3 M.2 slots support NVMe
★Support 5G Communication
★Operating Temperature: -20 to 60°C
★15-Year CPU Life Cycle Support Until Q2' 34 (Based on Intel IOTG Roadmap)

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高性能嵌入式计算机-EPC-1208

★8th/9th Generation Intel® Core™ Processors, LGA 1151
★Reliable fan-less Edge AI computer on 9th Generation Intel® Core™ Processors
★4 x RJ45 802.af PoE ports at 15W per port
★Up to 150W MXM GPU supported for AI acceleration
★Extended operating temperature up to -25°C to 70°C
★5G cellular and 4x swappable SSDs supported

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高性能嵌入式计算机-EPC-1209

★8th/9th Generation Intel® Core™ with Intel® Q370/H310/C246
★Supports DDR4 SODIMM up to 64GB
★Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detect)
★Rich I/O connectivity: 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0
★3 M.2 slots support NVMe
★Support 5G Communication
★Operating Temperature: -20 to 70°C
★15-Year CPU Life Cycle Support Until Q1' 32 (Based on Intel IOTG Roadmap)

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高性能嵌入式计算机-EPC-1210

★7th Generation Intel® Core™ Processors, BGA 1440
★Three independent displays: 1 VGA + 1 DVI/HDMI + 1 HDMI/DP
★Rugged and Fanless Embedded System
★Rich I/O connectivity: 2 GbE, 8 COM, 8 USB 3.0, 2 USB 2.0, 1 M.2 NVMe slots
★3 expension slots: PCIe + PCI
★Supports DDR4 SODIMM up to 32GB
★15-Year CPU Life Cycle Support Until Q1' 32 (Based on Intel IOTG Roadmap)

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高性能嵌入式计算机-EPC-1211

★Intel® 7th Gen Kaby Lake Mobile Processors Xeon/Core i7/i5/i3
★Rugged and Fanless Embedded System, Wide Temperature: -40 to +70°C
★Supports Dual Channel DDR4 SODIMM up to 64GB
★Triple Independent Displays: 1 VGA + 1 DVI or HDMI + 1 HDMI or DP
★Rich I/O connectivity: 4 PoE + 2 LAN, 5 COM, 4 USB 3.0, 2 USB 2.0, 1 M.2 NVMe slots
★Supports 1 PCIe x16 or 1 PCI
★15-Year CPU Life Cycle Support Until Q1' 32 (Based on Intel IOTG Roadmap)

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高性能嵌入式计算机-EPC-1212

★7th Generation Intel® Core™ Processors, BGA 1440
★Three independent displays: 1 VGA + 1 DVI/HDMI + 1 HDMI/DP
★Rugged and Fanless Embedded System
★Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.0, 2 USB 2.0, 1CFast
★Supports 2 Mini PCIe and 1 M.2 NVMe slots
★Supports DDR4 SODIMM up to 32GB
★Operating Temperature: -20 to 60°C, -40 to 70°C (optional)
★15-Year CPU Life Cycle Support Until Q1' 32 (Based on Intel IOTG Roadmap)

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高性能嵌入式计算机-EPC-1213

★第六代/第七代Intel® Core™及Intel® Q170
★支持 DDR4 SODIMM 高达32GB
★三个独立显示: 1 VGA + 1 DVI/HDMI + 1 HDMI/DP
★支持 4 PoE G网口及1个扩充插槽
★2 Mini PCIe slots 支持 mSATA 及 Wi-Fi 模块
★15年CPU长期支持至Q4' 30 (Based on Intel IOTG Roadmap)

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高性能嵌入式计算机-EPC-1214

★第六代/第七代Intel® Core™及Intel® Q170
★支持 DDR4 SODIMM 高达32GB
★三个独立显示: 1 VGA + 1 DVI/HDMI + 1 HDMI/DP
★丰富I/O连接能力: 2 网口, 6 串口, 8 USB 3.0
★3 个扩充插槽: PCIe x16 + PCI
★15年CPU长期支持至Q4' 30 (Based on Intel IOTG Roadmap)

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高性能嵌入式计算机-EPC-1215

★第六代/第七代Intel® Core™及Intel® Q170
★支持 DDR4 SODIMM 高达32GB
★三个独立显示: 1 VGA + 1 DVI/HDMI + 1 HDMI/DP
★丰富I/O连接能力: 2 网口, 4 串口, 4 USB 3.0, 2 USB 2.0
★2 Mini PCIe slots 支持 mSATA 及 Wi-Fi 模块
★15年CPU长期支持至Q4' 30 (Based on Intel IOTG Roadmap)

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高性能嵌入式计算机-EPC-1216

★Intel Atom® 处理器 E3800 模块化设计系统
★为工业应用打造，无风扇轻巧设计
★支持 DDR3L SODIMM 高达8GB
★2x 2.5" SATA 磁盘架
★1 个垂直USB以保护资料被未经授权的人员存取 (选配)
★15年CPU长期支持至Q4' 28 (Based on Intel IOTG Roadmap)

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高性能嵌入式计算机-EPC-1217

★Intel Atom® 处理器 E3800 模块化设计系统
★支持 DDR3L SODIMM 高达8GB
★2x 2.5" SATA 磁盘架
★1 个垂直USB以保护资料被未经授权的人员存取 (选配)
★1 PCI 扩展槽
★15年CPU长期支持至Q4' 28 (Based on Intel IOTG Roadmap)

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高性能嵌入式计算机-EPC-1218

★Intel Atom® 处理器 E3800 模块化设计系统
★支持 DDR3L SODIMM 高达8GB
★2x 2.5" SATA 磁盘架
★1 个垂直USB以保护资料被未经授权的人员存取 (选配)
★1 个垂直USB以保护资料被未经授权的人员存取 (选配)
★15年CPU长期支持至Q4' 28 (Based on Intel IOTG Roadmap)

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AI边缘计算平台-AIPC-2020

★6/8-core Arm® Cortex®-A78AE v8.2 64-bit CPU
★Nvidia Edge AI engine: NVIDIA® Jetson Orin Nano™ or NX
★Multi GbE ports with PoE: Four RJ45 GbE ports and optional 2x PoE
★Optional OOB (out-of-band) support
★Multiple Expansions: 1 M.2 2230 E-Key, 1 M.2 2280 M-Key, 1 M.2 3042/3052 B-Key
★Rich I/O: 1 COM/CANBus/DIO, 2 USB 3.2

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AI边缘计算平台-AIPC-2021

★Intel® Core™ Ultra Processor
★Reinforce Nvidia ORIN NX computing power by Intel® Core™ Ultra Processor
★AI engine NVIDIA Jetson Orin NX, up to 100 TOPS
★Support Remote management and OTA by DFI OOB module
★4 M.2 B, E, M key expansion slots
★Optional MXM supported with 3 DP and 1 HDMI ports
★4 USB 3.2, 4 RJ45 GbE, micro USB, Serial, CAN bus

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AI边缘计算平台-AIPC-2022

★8th/9th Generation Intel® Core™ Processors
★Multiple displays: 4 DP (from MXM), 1 DP/HDMI
★AI Accelerated: Up to 60W GPU MXM module supported
★Scalability: 3 M.2 expansion slots
★Support M.2 B key 3052 5G cellular module
★Rich I/O connectivity: 4 LAN, 4 USB 3.1, 2 COM

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AI边缘计算平台-AIPC-2023

★8th/9th Generation Intel® Core™ Processors
★Multiple displays: 4 DP (from MXM), 1 HDMI (auto-detection)
★AI accelerated: up to 115W GPU MXM module supported
★Support M.2 B key 3052 5G cellular module
★Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM
★15-Year CPU Life Cycle Support Until Q2' 34 (Based on Intel IOTG Roadmap)

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AI边缘计算平台-AIPC-2024

★8th/9th Generation Intel® Core™ Processors, LGA 1151
★Reliable fan-less Edge AI computer on 9th Generation Intel® Core™ Processors
★4 x RJ45 802.af PoE ports at 15W per port
★Up to 150W MXM GPU supported for AI acceleration
★Extended operating temperature up to -25°C to 70°C
★5G cellular and 4x swappable SSDs supported

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