车载工业计算机-OBPC-7273

★Powered by 12/13th Gen Intel® Core™ CPU
★Fanless, compact and rugged design
★Designed with DDR5, excellent memory bandwidth, lower latency
★2 x 2.5” SSD for data integrity (compatible with 15mm disk)
★5G/Wi-Fi, PoE, 10GbE, daughter board expansion support
★4 x Independent 10/100/1000/2500 Mbps PoE 802.3af/at, total 60W (nROK 7271-WIC4 w/o PoE expansion board) / 30W (nROK 7271-WIC4 w/ PoE expansion board)
★EN 50155, class OT3 conformity
★Wide voltage input 24~110VDC (w/ isolation)
ꄴ上一个： 车载工业计算机-OBPC-4020
ꄲ下一个： 车载工业计算机-OBPC-7272

  • 产品规格

    CPU Intel® 12/13th Gen Core™ CPU (65W/35W), Chipset: Intel R680E, Graphics: Intel® UHDGraphics770,1.55GHz
    Memory 2 x 262-pin SO-DIMM, DDR5 4800MHz64GB in max., ECC & dual-channel support
    Video Output 1 x HDMI 2.0a/b, up to 3840 x 2160@60Hz1 x VGA, up to 1920 x 1200@60Hz
    Storage 2 x 2.5” SATA 3.0 external SSD (15mm height, removable)1 x mSATA (occupied mini-PCIe slot)2 x M.2 Key B (occupied M.2 socket)1 x microSD card slot, SDXC v3.01
    Expansion 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0)2 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.2 Gen 2, SATA 3.0) for LTE/5G NR module with 1 x external dual nano-SIMs1 x M.2 2230 Key E socket (USB 2.0, PCIe 3.0 x2), BOM optional M.2 2230 Key E socket (USB 2.0, PCIe 3.0, PCIe 3.0)
    GNSS and Onboard Sensor 1 x Default U-blox NEO-M9N GNSS module for GPS+QZSS/Glonass/Galileo/Beidou1 x 3D accelerometer and 3D gyroscope
    LAN and Power over Ethernet nROK 7271-WIC4:
    - 1-port LAN M12 X-coded, 10/100/1000/2500 Mbps Intel® I226 GbE (support WOL)
    - 4-port Independent LAN M12 X-coded, 10/100/1000/2500 Mbps Intel® I226-IT GbE, PoE 802.3af/at, max. 60W, non-isolation (w/o PoE expansion board) / 30W (w/ PoE expansion board)nROK 7271-WI:
    - 2-port LAN M12 X-coded, 10/100/1000/2500 Mbps Intel® I226 GbE (support WOL)
    Security TPM 2.0: InfineonSLB9665TT2.0FW5.62
    I/O Interface-Front 4 x LED indicators (storage/WWAN/WLAN/programmable)1 x HDMI 2.0a/b2 x USB 3.2 Gen 2 type A (5V/0.9A)2 x Externally accessible dual nano-SIM card sockets with cover1 x microSD card slot with cover2 x 2.5” removable SSD tray1 x Reset button1 x Power buttonnROK 7271-WIC4 :
    - 1 x M12 X-coded LAN port
    - 4 x M12 X-coded PoE 802.3af/atnROK 7271-WI:
    - 2 x M12 X-coded LAN port1 x Fan power connector1 x SMA connector for GNSS4 x SMA connector holes for WWAN2 x Externally accessible dual nano-SIM card socket holes with cover, 8 x SMA connector holes for WWAN, and 2 x RP-SMA connector holes for WLAN (reserved for 5G/Wi-Fi expansion board)
    I/O Interface-Rear 1 x VGA1 x M12 A-coded 8-pin for 2 x USB 2.01 x M8 (AUDIO) for 1 x Mic-in, 1 x Line-out2 x DB9 (COM1/2) for full RS232/422/485 (isolation)1 x DB15 (CAN/DIO)
    - 2 x Isolated CAN FD, compatible with CAN2.0A/2.0B
    - 4 x DI and 4 x DO (isolation), power in source for DIO isolation, 14~48VDC1 x M12 K-coded 5-pin for power input1 x Connector 2-pin for ignition input4 x SMA connector holes for WWAN4 x RP-SMA connector holes for WLAN
    Power Management & Software Support Power input 24~110VDC w/ isolation (occupied rear side expansion)Optional 2.2~3 sec (170W~120W) protection against temporary voltage dips (w/ supercap board, occupied rear side expansion)Selectable boot-up & shut-down voltage for low power protection by softwareSetting 8-level power on/off delay time by softwareSupport S3/S4 suspend mode10~255 seconds WDT support, setup by softwareSDK (Windows/Linux) including utility and sample code
    Operating System Windows 11/Windows 10/Linux
    Dimensions 260 x 210 x 110 (W x D x H) (mm)
    Weight nROK 7271-WIC4: 6.98kgnROK 7271-WI: 6.93kg
    Environment Operating temperatures
    - EN 50155, class OT3 (-35°C ~70°C), 85°C for 10 minutes (w/ 35W TDP CPU, 60W PoE, 8GB memory, industrial SSD) with air flowStorage temperatures: -40°C to 80°CRelative humidity: 90% (non-condensing)Vibration (random)
    - 2g@5~500 Hz (in operation, SSD)Vibration (SSD)
    - Operating: MIL-STD-810H, Method 514.8C, Procedure 1, Category 4, common carrier US highway truck vibration exposure
    - Storage: MIL-STD-810H, Method 514.8E, Procedure 1, Category 24, minimum integrity testShock (SSD)
    - Operating: MIL-STD-810H, Method 516.8, Procedure I, functional shock=40g
    - Non-operating: MIL-STD-810H, Method 516.8, Procedure V, crash hazard shock test=75g
    Certifications CE/UKCA/FCC Class AEN 50155: 2021
    - Ambient temperature EN 50155, Class OT3 (-35°C ~70°C), 85°C for 10 minutes
    - Interruptions of voltage supply class S1, S2 (w/ supercap board), S3 (w/ supercap board)
    - Supply change over class C1, C2 (w/ supercap board)
    - EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
    - Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
    - Shock and vibration IEC 61373 Class B
    - Protective coating class PC1 (PC2, by request)EN 45545-2: 2020+A1: 2023
    Options Intel® Core™ CPU:
    - i9-12900E/12900TE, Core: 16c, Max Freq.: 5.0/4.8GHz, TDP: 65W/35W
    - i7-12700E/12700TE, Core: 12c, Max Freq.: 4.8/4.6GHz, TDP: 65W/35W
    - i5-12500E/12500TE, Core: 6c, Max Freq.: 4.5/4.3GHz, TDP: 65W/35W
    - i3-12100E/12100TE, Core: 4c, Max Freq.: 4.2/4.0GHz, TDP: 60W/35WSO-DIMM DDR5-4800MHz:
    - 64GB (in the future), 32GB, 16GB, 8GBFAN Kit
    - Model No.: VTK FAN120-02, Description: 120mmx120mm, P/N: 10VK00FAN02X0
    * Note: 65W CPU should be bundled with fan kit
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