车载工业计算机-OBPC-7258
★Intel® Coffee Lake S/Refresh 8th/9th Gen Core™/Xeon® LGA1151 socket-type CPU
★Six SIM cards + three WWAN modules support
★LTE/5G WWAN module support
★4 x External SSD for RAID 0, 1, 5, 10 (compatible with 15mm disk)
★2 x mSATA (occupied mini-PCIe slot)
★EN 50155, class OT4 conformity
★Three video outputs, one VGA and two HDMI
★3 x mini-PCIe + 2 x M.2 socket expansion
★1 x SD card for exporting and backing up data
★Six SIM cards + three WWAN modules support
★LTE/5G WWAN module support
★4 x External SSD for RAID 0, 1, 5, 10 (compatible with 15mm disk)
★2 x mSATA (occupied mini-PCIe slot)
★EN 50155, class OT4 conformity
★Three video outputs, one VGA and two HDMI
★3 x mini-PCIe + 2 x M.2 socket expansion
★1 x SD card for exporting and backing up data
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产品规格
CPU Support 9th/8th generation Intel® Core™ i7/i5/i3, Xeon® LGA1151 socket
- Intel® Core™ i7-9700TE/i7-8700T, TDP 35W
- Intel® Core™ i5-9500TE/i5-8500T, TDP 35W
- Intel® Core™ i3-9100TE/i3-8100T, TDP 35W
- Intel® Xeon® E-2278GEL, TDP 35W
- Intel® Celeron® G4900T, TDP 35WChipset Intel® C246 platform controller hub Memory 2 x 260-pin DDR4 SO-DMIM sockets up to 32GB/channel (64GB for two channels)ECC memory to support: i3-9100TE/i3-8100T, E-2278GEL, G4900T Video Output Chipset Intel® UHD graphics 6302 x HDMI 1.4b up to 4096 x 2160 @ 30Hz1 x VGA up to 1920 x 1200 @ 60Hz Storage 4 x 2.5” SATA 3.0 external SSD (15mm)2 x mSATA (occupied mini-PCIe slot)1 x Removable SD 3.0 Expansion 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA)1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA), BOM optional M.2 3042 Key B socket (USB 2.0, USB 3.1 Gen 1) for LTE/5G NR module with 2 x external SIM1 x Full size mini-PCIe socket (USB 2.0, USB 3.1 Gen 2 (BOM optional)) for LTE module, BOM optional M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2, PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM2 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2, PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM GNSS and Onboard Sensor 1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/BeidouG Sensor (3-axis, 10-bit resolution) LAN and Power over Ethernet 2-Port LAN M12 X-coded, 10/100/1000 Mbps Intel® I210/I219 (support iAMT) GbE8-Port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 60W Security TPM 2.0: Infineon SLB9665TT2.0FW5.62 I/O Interface-Front 24 x LED indicators (including 3 x programmable LED)2 x HDMI 1.4b1 x VGA1 x USB 3.1 Gen 2 type A (5V/1A)1 x USB 3.1 Gen 1 type A (5V/1A)6 x Externally accessible SIM card sockets with cover4 x 2.5” removable SSD tray1 x SD with cover1 x Reset button1 x Power button10 x SMA antenna I/O Interface-Rear 2 x LAN M12 X-coded, I210/I219 10/100/1000 Mbps8 x PoE 802.3af/at (max. 60W), M12 X-coded1 x Mic-in, 2 x Line-out (AUDIO, DB9, female)1 x M12 A-coded connector for 2 x USB 2.02 x USB 3.1 (5V/1A) type A2 x DB9 (COM1/COM2) for full RS232 (isolation)1 x DB9 (COM3) for full RS232/422/485 (isolation)1 x DB15 (CAN/DIO)
- 1 x Isolated CANBus 2.0B
- 4 x DI and 4 x DO (isolation)
- Power in for DIO isolation, 9~48VDC1 x Waterproof DC input connector with ignition
- DC 24V/36V (w/o isolation)3 x SMA antennaPower Management & Software Support Power input 24VDC/36VDC w/o isolationSelectable boot-up & shut-down voltage for low power protection by softwareSetting 8-level power on/off delay time by softwareSupport S3/S4 suspend mode10~255 seconds WDT support, setup by softwareSDK (Windows/Linux) including utility and sample code Operating System Windows 10/Linux Dimensions 260 x 266 x 110 (W x D x H) (mm) Weight 6.8kg Environment Operating temperatures: EN 50155, class OT4 -40~70°C, 85°C for 10 minutes (w/ industrial SSD) with air flowStorage temperatures: -40°C to 80°CRelative humidity: 90% (non-condensing)Vibration (random)
- 2g@5~500 Hz (in operation, SSD)Vibration (SSD)
- Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure
- Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity testShock (SSD)
- Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75gCertifications CEFCC Class AEN 50155: 2017
- Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
- Interruptions of voltage supply class S1
- Supply change over class C1, C2
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, by request)EN 45545-2:2013+A1:2015 (PCB) -
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2022-07-12 DFI-ALF51-1.8-SBC-QR.pdf
끂12 138.02 KB -
2022-07-12 DFI-ALF51-1.8-SBC-Manual.pdf
끂9 2.56 MB -
2022-07-12 DFI-ALF51-1.8-SBC-DataSheet.pdf
끂11 830 KB -
2022-07-12 ALF51 RoHS Certification.pdf
끂12 50.66 KB -
2022-07-12 ALF51 FCC Certificatioin.pdf
끂11 208.92 KB
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2022-07-12 ALF51_TXE_Driver.zip
끂0 44.66 MB -
2022-07-12 ALF51_SIO_Driver.zip
끂0 1.69 MB -
2022-07-12 ALF51_LAN_Driver.zip
끂0 71.95 MB -
2022-07-12 ALF51_Graphics_Driver.zip
끂0 316.53 MB -
2022-07-12 ALF51_Chipset_Driver.zip
끂0 3.64 MB
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