车载工业计算机-OBPC-7270
★Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
★Rich I/Os, 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
★Up to 2 Hailo AI accelerator (26TOPS workload each) computing power as optional
★Up to 4 WWAN/WLAN combinations for mobile router applications
★9~36V DC-IN with ignition control & OCP/OVP
★Wide range operating temperature of -35°C~70°C (fanless@35W CPU)
★Rich I/Os, 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
★Up to 2 Hailo AI accelerator (26TOPS workload each) computing power as optional
★Up to 4 WWAN/WLAN combinations for mobile router applications
★9~36V DC-IN with ignition control & OCP/OVP
★Wide range operating temperature of -35°C~70°C (fanless@35W CPU)
-
产品规格
CPU 12/13th Gen Intel® Core™ i, Intel® R680E chipsetGraphics:
- Intel® UHD Graphics 770, 1.55GHz
- Max resolution: 4096 x 2160@60Hz (HDMI)
- DirectX: 12, OpenGL: 4.5Memory (optional) 2 x SO-DIMM, DDR5-4800MHzECC & dual-channel support Storage 2 x 2.5” SSD (15mm height, removable)1 x M.2 2280 Key M (PCIe4.0 x4), NVMe SSD in default, Hailo AI card (optional) Expansion Slots 1 x mPCIe slot (PCIe 3.0, SATA 3.0, USB 2.0), Wi-Fi (default), optional for mSATA1 x mPCIe slot (USB 3.2, PCIe 3.0, SATA 3.0), SIMs support, LTE modem (default), optional for Wi-Fi/mSATA by DIP S/W setting1 x M.2 3042/50/52 Key B socket (USB 3.2/2.0), SIMs support for LTE/5G modem1 x M.2 2230 Key E socket (PCIe 3.0 x 2 & USB 2.0), Wi-Fi (default), Hailo AI card in option Display 1 x HDMI 2.0a/b, up to 3840 x 2160@60Hz1 x VGA, up to 1920 x 1200@60Hz; 1 x DP, 4096x2304@60Hz 2.5GbE 2-port independent 2.5GbE, RJ45 connector
- 9Kbyte Jumbo frame
- PTP (IEEE 1588) support
- Controller: Intel® I226-ITGbE/MGT 1-port independent GbE, RJ45 connector
- vPro (iAMT)
- 9KB Jumbo frame
- PTP (IEEE 1588) support
- Wake-up function (WoL)
- Boot from PXE (Legacy & UEFI)USB 6 x USB 3.2 Gen 2:
- Host Type-A connector
- 5V@900mA each
- Up to 10Gbit/s link speed & compliance with USB 2.0 (LS/FS/HS link speed)Serial Port 2 x Full RS232/422/4852 x Full RS232RS232 working voltage, +- 9V, baud rate up to 115.2kb/s2-wire/4-wire RS-485 (Baud rate: 300~115.2Kbps) Security TPM 2.0: Infineon SLB9670VQ2.0 FW7.62 Audio & DC-OUT Line-out, unbalance stereo, left & right channelLine-in & MIC-in, stereoDC-OUT: 12VDC@2A MEMS Sensor 3D accelerometer and 3D gyroscope, ST LSM6DSLTR DI/DO 4-bit input
- Source: 9~36VDC (12V@1.1mA/24V@2.2mA)
- External: 0~33VDC pull-high, high-level, 3.3 - 33 VDC; low-level, 0 - 2 VDC4-bit output
- Source: 9~36VDC (nominal 35mA@24V)
- External: 5~27VDC pull-high, sink current w/ 220mA for each bit, 500mA max (@25C)Source or external can be selected by DIP S/W (default: source type)CAN Bus 2 x CAN FD, compatible with CAN2.0A/2.0BUp to 5Mb/s in data transmitIEC 61000-4-2 Electrostatic Discharge (ESD): ± 4KV/8KV (contact/air) GNSS u-blox NEO-M9N GNSS module for GPS/Gloness/QZSS/Galileo/BeidouOptional DR (Dead Reckoning) function, NEO-M9V/M8L Power Supply Nominal voltage: 9~36VCranking voltage: 6V~9V (less than 20 sec)OCP & UVP (shut down once exceeding 37V)Ignition on/off control & programmable on/off delay timerOptional for remote power on/off control I/O Ports, Front-Plate ATX power & reset button9 x LED Indicators4 x Nano SIM slots (SIM1-1, SIM1-2, SIM2-1, SIM2-2)2 x USB3.2 Type A1 x HDMI, 1 x DPFan power connector4 x 2.5GbE (RJ45), 1 x GbE (RJ45)2 x Removable 2.5” SSD bay1 x Multi-port DB15 (4 x DI, 4 x DO, 2 x CAN FD)1 x PR-SMA for GNSS, 2/4 x SMA for LTE/5G ant. I/O Ports, Rear-Plate 2 x RS232 (DB9), 2 x RS232/422/485 (DB9)4 x USB 3.2 type AAudio jack for Line-in, Line-out, MIC-in1 x VGA1 x Mini-fit connector (DR signal & DC-OUT)5-pin Phoenix for 9~36VDC-in2/4 x PR-SMA for Wi-Fi ant. Dimensions & Weight 260.0mm x 210.0mm x 81.0mm (w/o mount bracket)293.0mm x 210mm x 90.0mm (w/ mount bracket)5.7kg, 6.8kg (w/ fan kit) Environment Operating temperatures: -35°C~70°C (35W CPU, fanless)Operating temperatures: -35°C~70°C (65W CPU, w/ fan)Storage temperatures: -40°C~85°CRelative humidity: 10%~95% (non-condensing) Vibration & Shock Vibration in operating:
- MIL-STD-810H, 514.8C Procedure 6, Category 4
- IEC 60068-2-64: 2.0g@5~500 HzVibration in storage:
- MIL-STD-810H, 514.8E Procedure 1, Category 24, 7.7gShock:
- MIL-STD-810H, 516.8 Procedure I, trucks and semi-trailers=40g
- Crash hazard: Procedure V, ground equipment=75gCertifications CE approval, FCC Class A, UKCA, E13 Certified Operating System Windows 10 64-bit/ Windows 10 IOT 64-bit, Windows 11Linux (Ubuntu 18.04) Options CPU:
- Intel® Core™ i9-12900E/12900TE, Core: 16c, Max Freq.: 5.0/4.8GHz, TDP: 65W/35W
- Intel® Core™ i7-12700E/12700TE, Core: 12c, Max Freq.: 4.8/4.6GHz, TDP: 65W/35W
- Intel® Core™ i5-12500E/12500TE, Core: 6c, Max Freq.: 4.5/4.3GHz, TDP: 65W/35W
- Intel® Core™ i3-12100E/12100TE, Core: 4c, Max Freq.: 4.2/4.0GHz, TDP: 60W/35WSO-DIMM DDR5-4800MHz:
- CPU: 64GB (in the future), Core: 32GB, Freq.: 16GB, TDP: 8GBFAN Kit
- Model No.: VTK FAN120-01, Description: 120mmx120mm, 60W heat dissipate, P/N: 10VK00FAN00X0 -
-
2022-07-12 DFI-ALF51-1.8-SBC-QR.pdf
끂12 138.02 KB -
2022-07-12 DFI-ALF51-1.8-SBC-Manual.pdf
끂9 2.56 MB -
2022-07-12 DFI-ALF51-1.8-SBC-DataSheet.pdf
끂11 830 KB -
2022-07-12 ALF51 RoHS Certification.pdf
끂12 50.66 KB -
2022-07-12 ALF51 FCC Certificatioin.pdf
끂11 208.92 KB
-
-
-
2022-07-12 ALF51_TXE_Driver.zip
끂0 44.66 MB -
2022-07-12 ALF51_SIO_Driver.zip
끂0 1.69 MB -
2022-07-12 ALF51_LAN_Driver.zip
끂0 71.95 MB -
2022-07-12 ALF51_Graphics_Driver.zip
끂0 316.53 MB -
2022-07-12 ALF51_Chipset_Driver.zip
끂0 3.64 MB
-
关于我们
资讯动态
服务支持
联系我们
电话:400-618-6692
邮箱:sales@lanruitech.com
微
信
公
众
号
-
ꁸ 回到顶部
-
ꂅ 400-618-6692
-
ꁗ QQ客服
-
ꀥ 微信二维码