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COMe及嵌入式电脑模块-COMe-6026

★COM Express® R3.0, Pin-out Type 7
★支援 Compact and Basic 模块
★多重扩充讯号: 8 PCIe x4 or 4 PCIe x8, 2 SATA 3.0
★丰富 I/O: 2 网口, 4 10Gbase-KR, 4 USB 3.0/2.0, 1 串口
★microATX form factor
ꄴ上一个： COMe及嵌入式电脑模块-COMe-6027
ꄲ下一个： COMe及嵌入式电脑模块-COMe-6025

  • 扩充

    界面

    B1: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
    B2: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
    B3: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
    B4: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)

    背板输入/输出

    以太网络

    4 x 10GbE LAN (2 x SFP+, 2 x RJ-45) by 10GBASE-KR interface
    2 x 1GbE LAN (RJ-45) (one from module; another from BMC for remote management)

    串口

    1 x RS-232 (DB-9) (supports by BMC which default is debug port and may switch to normal RS-232)

    USB

    4 x USB 3.0/2.0

    内部输入/输出

    串行端口

    2 x Serial Interface Connectors (TX/RX) (2.0mm pitch)

    SATA

    2 x SATA 3.0 (up to 6Gb/s)

    DIO

    1 x 8-bit DIO (4 input, 4 output)
    1 x SDIO (conditionally available)

    LPC

    1 x LPC

    SMBus

    1 x SMBus

    I2C

    1 x I2C

    电源

    端口

    4-pin ATX 12V power 24-pin ATX power

    电池

    CR2032 Coin Cell

    环境指标

    温度

    Operating: 0 to 60°C
    Storage: -40 to 85°C

    湿度

    Operating: 5 to 90% RH
    Storage: 5 to 90% RH

    MTBF

    246,013 hrs @ 25°C; 121,445 hrs @ 45°C; 68,565 hrs @ 60°C
    46,970 hrs @ 70°C
    Calculation model: Telcordia Issue 4
    Environment: GB, GC – Ground Benign, Controlled

    机械结构

    尺寸

    microATX Form Factor 244mm (9.6") x 244mm (9.6")

    规范

    PICMG COM Express® R3.0, Type 7 Basic, Compact Modules

    智能平台管理接口

    特性

    1. IPMI 2.0
    2. Web Browser Support
    3. Web Interface
    4. iKVM (keyboard, video, and mouse)
    5. Virtual Media
    6. 3rd Party Authentication
    7. Firmware Update
    8. SMASH/CLP
    9. WS-MAN
    10. Network Service

    处理器

    AST2500

    SDRAM

    DDR4-2400 1200MHz 8Gb memory down

    显示

    Through BMC to convert VGA signal
    VGA: resolution up to 1920 x 1200 x 32bpp (share with SOC 16MB memory)

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