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COMe及嵌入式电脑模块-COMe-6025

★COM Express® R2.1, Pin-out Type 6
★Supports Compact and Basic modules
★Multiple displays: VGA, LVDS, DP, eDP
★Rich I/O: 1 GbE, 4 USB 3.1, 4 USB 2.0
★microATX form factor
ꄴ上一个： COMe及嵌入式电脑模块-COMe-6026
ꄲ下一个： COMe及嵌入式电脑模块-COMe-6023

  • 显示

     

    显示器

    1 x VGA
    1 x LVDS/eDP (eDP available upon request)
    3 x DP
    1 x eDP/LVDS (LVDS available upon request)

    扩充

    界面

    1 x PCIe x16
    4 x PCIe x1
    1 x M.2 M Key 2280
    1 x SDIO

    音讯

    音讯编译码器

    Realtek ALC888S-VD2-GR

    背板输入/输出

    以太网络

    1 x GbE (RJ-45)

    USB

    4 x USB 3.1 (Gen2)
    4 x USB 2.0

    显示

    3 x DP

    音源

    1 x Line-in
    1 x Line-out
    1 x Mic-in

    内部输入/输出

    串行端口

    2 x Serial Interface Connector (TX/RX)

    显示

    1 x VGA (2.54mm)
    1 x LVDS LCD Panel Connector
    1 x LCD/Inverter Power
    1 x eDP LCD Panel Connector

    音效

    1 x Audio (Line-out/Mic-in)
    1 x S/PDIF

    SATA

    4 x SATA 3.0 (up to 6Gb/s)

    DIO

    1 x 8-bit DIO

    LPC

    1 x LPC

    SMBus

    1 x SMBus

    电源

    类型

    12V, 5VSB, VCC_RTC (ATX mode)
    12V, VCC_RTC (AT mode)

    端口

    4-pin ATX 12V power
    24-pin ATX power

    RTC 电池

    CR2032 Coin Cell

    环境指标

    温度

    Operating: 0 to 60°C
    Storage: -40 to 85°C

    湿度

    Operating: 5 to 90% RH
    Storage: 5 to 90% RH

    MTBF

    488,117 hrs @ 25°C; 253,684 hrs @ 45°C; 136,621 hrs @ 60°C
    Calculation Model: Telcordia Issue 2, Method Case 3
    Environment: GB, GC – Ground Benign, Controlled

    机械结构

    尺寸

    microATX Form Factor
    244mm (9.6") x 244mm (9.6")

    规范

    PICMG COM Express® R2.1, Type 6
    Basic, Compact Modules

    安规认证

    认证

    CE, FCC, RoHS

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