microATX工业主板-EBC-6675
★4 DDR5 UDIMM up to 192GB
★Supports 3 independent displays: VGA, DP++, HDMI
★Supports 4K resolution
★Multiple Expansion: 1 PCIe x16, 1 PCIe x4, 2 PCI, 1 M.2 E key, 2 M.2 M key, 4 SATA 3.0
★Rich I/O: 1 Intel 2.5GbE, 1 Intel 1GbE, 6 COM, USB 3.2 Gen 2 (Q670E 4x), USB 3.2 Gen 1 (Q670E 2x, H610E 4x), USB 2.0 (Q670E 7x, H610E 6x)
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系统
处理器
14th Generation Intel® LGA 1700 Socket Processors, TDP support up to 125W
Intel® Core™ I9-14900 (24 Cores, 36M Cache, up to 2.0 GHz); 65W
Intel® Core™ I9-14900T (24 Cores, 36M Cache, up to 1.1 GHz); 35W
Intel® Core™ I7-14700 (20 Cores, 33M Cache, up to 2.1 GHz); 65W
Intel® Core™ I7-14700T (20 Cores, 33M Cache, up to 1.3 GHz); 35W
Intel® Core™ I5-14500 (14 Cores, 24M Cache, up to 2.6 GHz); 65W
Intel® Core™ I5-14500T (14 Cores, 24M Cache, up to 1.7 GHz); 35W
Intel® Core™ I5-14400 (10 Cores, 20M Cache, up to 2.5 GHz); 65W
Intel® Core™ I5-14400T (10 Cores, 20M Cache, up to 1.5 GHz); 35W
Intel® Core™ I3-14100 (4 Cores, 12M Cache, up to 3.5 GHz); 60W
Intel® Core™ I3-14100T (4 Cores, 12M Cache, up to 2.7 GHz); 35W
Intel® 300 (2 Cores, 6M Cache, up to 3.9 GHz); 46W
Intel® 300T (2 Cores, 6M Cache, up to 3.4 GHz); 35W
13th Generation Intel® LGA 1700 Socket Processors, TDP support up to 125W
Intel® Core™ I9-13900E (24 Cores, 36M Cache, up to 5.2 GHz); 65W
Intel® Core™ I9-13900TE (24 Cores, 36M Cache, up to 5.0 GHz); 35W
Intel® Core™ I7-13700E (16 Cores, 30M Cache, up to 5.1 GHz); 65W
Intel® Core™ I7-13700TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W
Intel® Core™ I7-13700T (16 Cores, 30M Cache, up to 4.9 GHz); 35W
Intel® Core™ I5-13500E (14 Cores, 24M Cache, up to 4.6 GHz); 65W
Intel® Core™ I5-13500TE (14 Cores, 24M Cache, up to 4.5 GHz); 35W
Intel® Core™ I5-13500T (14 Cores, 24M Cache, up to 4.6 GHz); 35W
Intel® Core™ I5-13400E (10 Cores, 20M Cache, up to 4.6 GHz); 65W
Intel® Core™ I3-13100E (4 Cores, 12M Cache, up to 4.4 GHz); 65W
Intel® Core™ I3-13100TE (4 Cores, 12M Cache, up to 4.1 GHz); 35W
Intel® Core™ I3-13100T (4 Cores, 12M Cache, up to 4.2 GHz); 35W
12th Generation Intel® LGA 1700 Socket Processors, TDP support up to 125W
Intel® Core™ i9-12900E (16 Cores, 30M Cache, up to 5.0 GHz); 65W
Intel® Core™ i9-12900TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W
Intel® Core™ i7-12700E (12 Cores, 25M Cache, up to 4.8 GHz); 65W
Intel® Core™ i7-12700TE (12 Cores, 25M Cache, up to 4.6 GHz); 35W
Intel® Core™ i5-12500E (6 Cores, 18M Cache, up to 4.5 GHz); 65W
Intel® Core™ i5-12500TE (6 Cores, 18M Cache, up to 4.3 GHz); 35W
Intel® Core™ i3-12100E (4 Cores, 12M Cache, up to 4.2 GHz); 60W
Intel® Core™ i3-12100TE (4 Cores, 12M Cache, up to 4.0 GHz); 35W
Intel® Pentium® G7400E (2 Cores, 6M Cache, 3.6 GHz); 46W
Intel® Pentium® G7400TE (2 Cores, 6M Cache, 3.0 GHz); 35W
Intel® Celeron® G6900E (2 Cores, 4M Cache, 3.0 GHz); 46W
Intel® Celeron® G6900TE (2 Cores, 4M Cache, 2.4 GHz); 35W芯片组
Intel® Q670E/H610E Chipset
内存
Four 288-pin UDIMM up to 192GB (Non-ECC)
Dual Channel DDR5 up to 4400 MHz
*Speed support list follow User’s ManualBIOS
AMI SPI 256Mbit
显示
控制器
Intel® UHD Graphics 700 series
特性
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9显示器
1 x VGA
1 x DP++
1 x HDMI 2.0a
VGA: resolution up to 1920x1200 @ 60Hz
DP++: resolution up to 4096x2304 @ 60Hz
HDMI: resolution up to 4096x2160 @ 24Hz三重显示
VGA + DP++ + HDMI
扩充
界面
1 x PCIe x16 (Gen 5)
1 x PCIe x4 (Gen 3) (co-lay M.2 M-key, function selected by BIOS.)
2 x PCI
1 x M.2 2230 E key (only Q670E support, PCIe/USB 2.0/Intel CNVi support) (Discrete Wifi 6E support)
1 x M.2 2242/2260/2280 M key (PCIe x2 NVMe/SATA/Intel RST support)
1 x M.2 2242/2260/2280 M key (PCIe x4 NVMe/Intel RST support) (co-lay PCIE x4 slot, function selected by BIOS.)音讯
音讯编译码器
Realtek ALC888
以太网路
控制器
RPS330-Q670E
1 x Intel® I226-LM (Core i9/i7/i5 support iAMT, co-lay I219-LM)
RPS330-H610E
1 x Intel® I219-V
1 x Intel® I226-V
背板输入/输出
以太网络
RPS330-Q670E
2 x 2.5GbE (RJ-45)
or 1 x 2.5GbE + 1 x GbE (RJ-45)
RPS330-H610E
1 x 2.5GbE + 1 x GbE (RJ-45)
串口
1 x RS-232/422/485 (RS-232 w/ power) (DB-9)
USB
RPS330-Q670E
4 x USB 3.2 Gen 2
RPS330-H610E
2 x USB 3.2 Gen2
2 x USB 3.2 Gen1
2 x USB 2.0
PS/2
1 x PS/2 (mini-DIN-6)
显示
1 x DP++
1 x HDMI 2.0a
1 x VGA音源
1 x Line-out
1 x Mic-in
1 x Line-in (opt. by request, MOQ required)内部输入/输出
串行端口
1 x RS-232/422/485 (RS-232 w/ power) (2.54mm pitch)
4 x RS-232 (2.54mm pitch)USB
RPS330-Q670E
2 x USB 3.2 Gen1
4 x USB 2.0 (2.54mm pitch)
1 x USB 2.0 vertical Type A
RPS330-H610E
2 x USB 2.0 (2.54mm pitch)
2 x USB 2.0 (2.54mm pitch), co-lay 1 x USB 2.0 vertical Type A
音效
1 x Front Audio Header
1 x S/PDIFSATA
4 x SATA 3.0 (up to 6Gb/s) (one port co-lay M.2 M-key (SATA))
RPS330-Q670E
(RAID 0/1/5/10)
DIO
4-IN / 8-OUT DIO
SMBus
1 x SMBus
监视定时器
看门狗定时器
System Reset, Programmable via Software from 1 to 255 Seconds
安全性
信赖平台模块
Nuvoton TPM 2.0
电源
类型
ATX
端口
8-pin ATX 12V power
24-pin ATX power耗能
TBD
RTC 电池
CR2032 Coin Cell
支持操作系统
微软
Windows 10 IoT Enterprise 64-bit
Windows 11 EnterpriseLinux
Linux
环境指标
温度
Operating: -5 to 65°C
Storage: -30 to 60°C with RTC Battery; -40 to 85°C without RTC Battery湿度
Operating: 5 to 95% RH
Storage: 5 to 95% RHMTBF
TBD
机械结构
尺寸
microATX Form Factor
244mm (9.6") x 244mm (9.6")高度
PCB: 1.6mm
Top Side: TBD
Bottom Side: TBD安规认证
认证
CE, FCC Class B, RoHS
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