3.5寸工业主板-EBC-3508
★1 DDR4 SODIMM up to 32GB
★Three independent displays: LVDS + DP++ + DP++
★DP++ resolution up to 4096x2304 @ 60Hz
★Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
★Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0
★15-Year CPU Life Cycle Support Until Q1' 35 (Based on Intel IOTG Roadmap)
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系统
处理器
8th Gen Intel® Core™ Processors, LGA 1151 Socket
Intel® Core™ i7-8700T Processor (6C/12T; Max speed 4.0 GHz; TDP 35W)
Intel® Core™ i5-8500T Processor (6C/6T; Max speed 3.5GHz; TDP 35W)
Intel® Core™ i3-8100T Processor (4C/4T; Max speed 3.1GHz; TDP 35W)
Intel® Pentium® G5400T Processor (2C/4T; Max speed 3.1GHz; TDP 35W)
Intel® Celeron® G4900T Processor (2C/2T; Max speed 2.9GHz; TDP 35W)
9th Gen Intel® Core™ Processors, LGA 1151 Socket
Intel® Core™ i7-9700TE Processor (8C/8T; Max speed 3.6GHz; TDP 35W)
Intel® Core™ i5-9500TE Processor (6C/6T; Max speed 3.6GHz; TDP 35W)
Intel® Core™ i3-9100TE Processor (4C/4T; Max speed 3.2GHz; TDP 35W)内存
One 260-pin SODIMM up to 32GB
Single Channel DDR4 2666MHz
C246 with ECC Support: Intel® Core i3-8100T/9100TE/Pentium G5400T/Pentium G4900TBIOS
Insyde SPI 128Mbit
显示
控制器
Intel® UHD 630 Graphics GT Series
特性
OpenGL 4.6, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2 (H.262), VC1, JPEG/MJPEG, HEVC/H.265, VP8, VP9, VP10
HW Encode: AVC/H.264, MPEG2 (H.262), JPEG/MJPEG, HEVC/H.265, VP8, VP9显示器
1 x LVDS
2 x DP++
LVDS: dual channel 48-bit, resolution up to 1920x1200 @ 60Hz
DP++: resolution up to 4096x2304三重显示
LVDS + DP++ + DP++
扩充
界面
1 x Full-size Mini PCIe (PCIe x1 up to Gen3/USB 2.0) (C246/Q370 opt.: USB 3.1 Gen1/USB 2.0)
1 x M.2 2280 M key (C246/Q370: NVMe PCIe x4/SATA 3.0 or H310: NVMe PCIe x1, SATA 3.0)
1 x SIM slot (optional for 3G/4G module)音讯
音讯编译码器
Realtek ALC262
以太网路
控制器
Intel® I211AT PCIe (10/100/1000Mbps) or Intel® I210IT PCIe (10/100/1000Mbps)
背板输入/输出
以太网络
2 x GbE (RJ-45)
USB
4 x USB 3.1 Gen2 (C246/Q370) or Gen1 (H310)
显示
2 x DP++
内部输入/输出
串行端口
1 x RS-232/422/485 (2.0mm pitch)
USB
2 x USB 2.0 (2.0mm pitch)
显示
1 x LVDS LCD Panel Connector
1 x LVDS Backlight音效
1 x Audio (Line-out/Mic-in)
SATA
1 x SATA 3.0 (up to 6Gb/s)
1 x SATA PowerDIO
1 x 8-bit DIO
SMBus
1 x SMBus
加热器
1 x 12V header (wide temp. only)
监视定时器
看门狗定时器
System Reset, Programmable via Software from 1 to 255 Seconds
安全性
信赖平台模块
fTPM 2.0
电源
类型
12VDC
端口
Vertical Type Connector (4-pin) (default)
DC Jack (available upon request)耗能
Typical: i7-8700T: 12V @ 0.86A (10.32Watt)
Max: i7-8700T: 12V @ 5.38A (64.56Watt)RTC 电池
CR2032 Coin Cell
支持操作系统
微软
Windows 10 IoT Enterprise 64-bit RS5
Linux
Linux
环境指标
温度
Operating:
-5 to 65°C for 35W/100C CPU (fanless); 35W 100C, 82C CPU (fan)
-30 to 80°C for 15W TDP down/100C CPU (fanless); 35W/100C CPU (fan)
*Note: A heater/polyfilm is recommended for motherboard warm up at -30°C.
Storage: -40 to 85°C湿度
Operating: 5 to 90% RH
Storage: 5 to 90% RHMTBF
CS551-H310-BCA: 740,203 hrs @ 25°C; 462,070 hrs @ 45°C; 305,215 hrs @ 60°C; 227,949 hrs @ 70°C
CS551-H310-ECA: 742,388 hrs @ 25°C; 464,078 hrs @ 45°C; 3067,73 hrs @ 60°C; 229,188 hrs @ 70°C
Calculation Model: Telcordia Issue 4
Environment: GB, GC - Ground Benign, Controlled机械结构
尺寸
3.5" SBC Form Factor
146mm (5.75") x 102mm (4.02")高度
PCB: 1.6mm
Top Side: 25.27mm, Bottom Side: 7.68 mm -
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2022-07-12 DFI-ALF51-1.8-SBC-QR.pdf
끂12 138.02 KB -
2022-07-12 DFI-ALF51-1.8-SBC-Manual.pdf
끂9 2.56 MB -
2022-07-12 DFI-ALF51-1.8-SBC-DataSheet.pdf
끂11 830 KB -
2022-07-12 ALF51 RoHS Certification.pdf
끂12 50.66 KB -
2022-07-12 ALF51 FCC Certificatioin.pdf
끂11 208.92 KB
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2022-07-12 ALF51_TXE_Driver.zip
끂0 44.66 MB -
2022-07-12 ALF51_SIO_Driver.zip
끂0 1.69 MB -
2022-07-12 ALF51_LAN_Driver.zip
끂0 71.95 MB -
2022-07-12 ALF51_Graphics_Driver.zip
끂0 316.53 MB -
2022-07-12 ALF51_Chipset_Driver.zip
끂0 3.64 MB
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